12000 RPM, 6 inch Wafer with
multiple utilities .
4 Inch Substrate, 365nm - 405 nm 350watts
Double side alignments
High Accuracy
With Gases facility
Temperature control Chuck
With Vacuum chamber
Temperature carrier
Gas facility
Laser Diode Chip
MEMS Processes
Deposition Process
Die Bonder
Scribe and break System
Our imaging systems use the latest technology for high-resolution and high-speed imaging. Choose from microscopy, spectroscopy, and more for your imaging needs.
We use cookies to analyze website traffic and optimize your website experience. By accepting our use of cookies, your data will be aggregated with all other user data.