Science and Technology

Thin Film Electrical Resistivity Measurement System is a clean room compatible, capable of measuring electrical resistivity of various thin films and substrate/wafer - Temperature Coefficient of Resistance (TCR) measurement in a vacuum chamber.

BOND Technology 

The increasing demand for technologies such as infrared (IR) thermal imaging sensors, quantum processors, and micro-LED displays drives the need for advanced interconnect solutions. These technologies require fine-pitch Indium Bump Interconnects (IBI) for high-density flip-chip bonding. Larger chip sizes, sub-micron alignment, and extreme environmental conditions pose significant 

High temperature and vacuum chambers

Reliability test, probe stations, and embedded systems for micro devices

Test Load Cell and other different material

Automation 

Laser Diode  

Low and High Power Laser Diode chip/bar